US 12,663,716 B2Granted

Chemical-resistant protective film

AssigneeNissan Chemical Corporation

InventorsTokio Nishita, Yuki Endo

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Abstract

A protective film formation composition contains a polymer having a unit structure represented by formula (1-1), a compound or a polymer having phenolic hydroxy group other than catechol, (C) a thermal acid generator, and (D) a solvent. (Ar represents a benzene, naphthalene, or an anthracene ring; R1 represents a hydroxy, mercapto, amino, halogeno, or an alkyl group that has 1-10 carbon atoms and that may be substituted or interrupted by a hetero atom and may be substituted by a hydroxy group; n1 represents an integer of 0-3; L1 represents a single bond or an alkylene group having 1-10 carbon atoms; E represents an epoxy group; when n2=1, T1 represents a single bond or an alkylene group having 1-10 carbon atoms and may be interrupted by an ether bond, an ester bond, or an amide bond; and when n2=2, T1 represents a nitrogen atom or an amide bond.)

Claims22

Dependent claims

A composition for forming a protective film against a wet etching liquid for semiconductor or a resist underlayer film-forming composition, the composition comprising:

(A) a polymer having a unit structure represented by the following formula (1-1):
wherein Ar represents a benzene ring, a naphthalene ring, or an anthracene ring;
R1 represents a hydroxy group, a mercapto group optionally protected by a methyl group, an amino group optionally protected by a methyl group, a halogeno group, or an alkyl group having 1 to 10 carbon atoms and being optionally substituted with or interrupted by a heteroatom and optionally substituted with a hydroxy group;
n1 represents an integer of 0 to 3;
L1 represents a single bond or an alkylene group having 1 to 10 carbon atoms;
E represents an epoxy group;
and, when n2 is 1, T1 represents a single bond or an alkylene group having 1 to 10 carbon atoms and being optionally interrupted by an ether linkage, ester linkage, or amide linkage;
and, when n2 is 2, T1 represents a nitrogen atom or an amide linkage;
(B) a compound or polymer having a phenolic hydroxy group other than catechol, wherein the compound or polymer (B) is represented by the following formula (2-1):
wherein each of R2 and T2 independently represents a halogeno group, a carboxy group, a nitro group, a cyano group, a methylenedioxy group, an acetoxy group, a methylthio group, an alkoxy group having 1 to 9 carbon atoms, an amino group optionally substituted with an alkyl group having 1 to 3 carbon atoms, a hydroxy group, or an alkyl group having 1 to 10 carbon atoms and being optionally substituted with a halogeno group;
each of A1 and A2 independently is an alkylene group having 1 to 10 carbon atoms, a divalent organic group derived from a bicyclo-ring compound, a biphenylene group, a divalent organic group represented by —CT2T3-, or a combination thereof, wherein T3 represents a hydrogen atom or a monovalent group represented by (formula 2-1-a):
wherein, in (formula 2-1-a), * represents a bonding site to the carbon atom to which T3 is bonded, and a represents an integer of 1 to 6;
each of n3 to n5 independently represents an integer of 0 to 2;
r2 represents an integer of 0 to 3;
and
each of m1 and m2 independently represents a number of 0 to 10,000,000;
(C) a thermal acid generator;
and
(D) a solvent.

16 more elements

A composition for forming a protective film against a wet etching liquid for semiconductor or a resist underlayer film-forming composition, the composition comprising:

(A) a polymer having a unit structure represented by the following formula (1-1):
wherein Ar represents a benzene ring, a naphthalene ring, or an anthracene ring;
R1 represents a hydroxy group, a mercapto group optionally protected by a methyl group, an amino group optionally protected by a methyl group, a halogeno group, or an alkyl group having 1 to 10 carbon atoms and being optionally substituted with or interrupted by a heteroatom and optionally substituted with a hydroxy group;
n1 represents an integer of 0 to 3;
L1 represents a single bond or an alkylene group having 1 to 10 carbon atoms;
E represents an epoxy group;
and, when n2 is 1, T1 represents a single bond or an alkylene group having 1 to 10 carbon atoms and being optionally interrupted by an ether linkage, ester linkage, or amide linkage;
and, when n2 is 2, T1 represents a nitrogen atom or an amide linkage;
(B) a compound or polymer having a phenolic hydroxy group other than catechol, wherein the compound or polymer (B) is a compound represented by the following formula (2-2):
wherein R3 represents a halogeno group, a carboxy group, a nitro group, a cyano group, a methylenedioxy group, an acetoxy group, a methylthio group, an alkoxy group having 1 to 9 carbon atoms, an amino group optionally substituted with an alkyl group having 1 to 3 carbon atoms, a hydroxy group, or an alkyl group having 1 to 10 carbon atoms and being optionally substituted with a halogeno group;
Q1 represents a single bond, an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, an imino group, an arylene group having 6 to 40 carbon atoms, or an alkylene group having 1 to 10 carbon atoms and being optionally substituted with a halogeno group;
a represents an integer of 1 to 6;
n6 represents an integer of 0 to 2;
and r3 represents an integer of 0 to 3;
(C) a thermal acid generator;
and
(D) a solvent.

14 more elements

A composition for forming a protective film against a wet etching liquid for semiconductor or a resist underlayer film-forming composition, the composition comprising:

(A) a polymer having a unit structure represented by the following formula (1-1):
wherein Ar represents a benzene ring, a naphthalene ring, or an anthracene ring;
R1 represents a hydroxy group, a mercapto group optionally protected by a methyl group, an amino group optionally protected by a methyl group, a halogeno group, or an alkyl group having 1 to 10 carbon atoms and being optionally substituted with or interrupted by a heteroatom and optionally substituted with a hydroxy group;
n1 represents an integer of 0 to 3;
L1 represents a single bond or an alkylene group having 1 to 10 carbon atoms;
E represents an epoxy group;
and, when n2 is 1, T1 represents a single bond or an alkylene group having 1 to 10 carbon atoms and being optionally interrupted by an ether linkage, ester linkage, or amide linkage;
and, when n2 is 2, T1 represents a nitrogen atom or an amide linkage;
(B) a compound or polymer having a phenolic hydroxy group other than catechol, wherein the compound or polymer (B) is a polymer having a unit structure represented by the following formula (3-1):
wherein T4 represents a hydrogen atom in addition to the alkyl group having 1 to 10 carbon atoms and being optionally substituted with a halogeno group;
R4 represents a halogeno group, a carboxy group, a nitro group, a cyano group, a methylenedioxy group, an acetoxy group, a methylthio group, an alkoxy group having 1 to 9 carbon atoms, an amino group optionally substituted with an alkyl group having 1 to 3 carbon atoms, a hydroxy group, or an alkyl group having 1 to 10 carbon atoms and being optionally substituted with a halogeno group;
r4 represents an integer of 0 to 3;
n7 represents an integer of 0 to 2;
and a represents an integer of 1 to 6;
(C) a thermal acid generator;
and
(D) a solvent.

14 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/025,336Filed 9 Sep 2021
Priority: JP 2020-15188810 Sep 2020
Published: US 2023/0333470 A119 Oct 2023
Granted: 23 Jun 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

G03F 7/0385
Macromolecular compounds which are rendered insoluble or differentially wettable: using epoxidised novolak resin
G03F 7/0045
Photosensitive materials: with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
G03F 7/168
Coating processes; Apparatus therefor: finishing the coated layer, e.g. drying, baking, soaking
G03F 7/2016
Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame: contact mask being…