Cantilever probe card device and cantilever probe module

A cantilever probe card device, comprising:

• a substrate including a plurality of first soldering pads and a plurality of second soldering pads, wherein the first soldering pads are arranged in a first row along an arrangement direction, and the second soldering pads are arranged in a second row along the arrangement direction, and wherein the second row is parallel to and spaced apart from the first row;
• and
• a cantilever probe module fixed onto the substrate and including:
• a plurality of first probes each being integrally formed as a single one-piece structure and including:
• a first main segment having a first soldering end portion and a first extending end portion respectively arranged on two opposite sides thereof along a predetermined direction that is perpendicular to the arrangement direction;
• a first arm segment connected to the first extending portion of the first main segment;
• and
• a first testing segment having an upright shape along the predetermined direction and connected to the first arm segment;
• and
• a plurality of second probes staggeredly arranged with the first probes, wherein each of the second probes is integrally formed as a single one-piece structure and includes:
• a second main segment having a second soldering end portion and a second extending end portion respectively arranged on two opposite sides thereof along the predetermined direction, wherein the second main segment has a main height along the predetermined direction;
• an extending segment connected to the second main segment, wherein the extending segment has an extension height along the predetermined direction, and wherein the extension height is within a range from 5% to 50% of the main height;
• a second arm segment connected to the extending segment;
• and
• a second testing segment having an upright shape along the predetermined direction and connected to the second arm segment;
• wherein the first soldering end portions of the first probes are fixed onto the first soldering pads, the second soldering end portions of the second probes are fixed onto the second soldering pads, and the first testing segments of the first probes and the second testing segments of the second probes are arranged in one row along the arrangement direction;
• wherein, when the first testing segments of the first probes and the second testing segments of the second probes jointly abut against a device under test (DUT), a pressure generated in the first testing segment of any one of the first probes is within a range from 95% to 105% of a pressure generated in the second testing segment of any one of the second probes;
• wherein, in any one of the second probes, the second main segment defines a layout region arranged inside of an outer contour thereof by a layout spacing, the second soldering end portion and the second extending end portion are respectively located at two opposite sides of the layout region along the predetermined direction, and the layout region has a plurality of thru-holes that occupy 3% to 70% of a region surroundingly defined by the outer contour, and wherein the layout spacing is within a range from 20 μm to 100 μm, an inner diameter of any one of the thru-holes is less than or equal to 100 μm, and any two of the thru-holes adjacent to each other have a spacing therebetween that is within a range from 10 μm to 50 μm.