Differential pressure measuring device and substrate treating facility including the same
AssigneeSemes Co., Ltd.
InventorDong Hoon Kang
Life of this patent
Estimating the term…
Abstract
Provided is a substrate treating facility, including: an index module on which a substrate is loaded or unloaded; a treating module for performing a substrate treatment on the substrate loaded into the index module; a buffer chamber disposed between the index module and the treating module; and a differential pressure measuring device for measuring a differential pressure between a pressure at a specific position inside the substrate treating facility and a pressure at a reference position serving as a reference, in which the differential pressure measuring device is provided outside the substrate treating facility.
Claims18
A substrate treating facility, comprising:
- an index module configured to load or unload a substrate;
- a treating module configured to perform a substrate treatment on the substrate loaded into the index module;
- a buffer chamber between the index module and the treating module;
- and
- a differential pressure measuring device configured to measure a differential pressure between a pressure at a specific position inside the substrate treating facility and a pressure at a reference position serving as a reference,
- wherein the differential pressure measuring device is provided on an outside of the substrate treating facility, and
- wherein the differential pressure measuring device includes:
- a first box unit in pressure communication with the specific position;
- a second box unit provided above the first box unit, the second box unit having a sealed inner space;
- and
- a third box unit provided inside the second box unit, wherein the reference position is an inside of the third box unit,
- wherein the first box unit includes a differential pressure board and a reference differential pressure board inside the first box unit, the differential pressure board is configured to measure the pressure at the specific position, and the reference differential pressure board is configured to measure the pressure at the reference position.
A differential pressure measuring device for measuring a differential pressure between a first pressure at a specific position and a second pressure at a reference position, the differential pressure measuring device comprising:
- a first box unit having a sealed inner space in pressure communication with the specific position;
- a second box unit disposed above the first box unit and having a sealed inner space;
- and
- a third box unit provided inside the second box unit and having an inner space configured to communicate with the inner space of the second box unit,
- wherein the second pressure is a pressure of the inner space of the third box unit,
- wherein the first box unit includes a differential pressure board provided in the inner space of the first box unit and configured to measure the first pressure and a reference differential pressure board provided in the inner space of the first box unit and measuring the second pressure.
A substrate treating facility, comprising:
- an index module configured to load or unloading a substrate;
- a treating module configured to perform a substrate treatment on the substrate loaded into the index module, and including a plurality of process chambers configured to perform different treatments on the substrate;
- a buffer chamber disposed between the index module and the treating module;
- a differential pressure measuring device disposed above the buffer chamber and is configured to measure a differential pressure between a pressure inside one of the plurality of process chambers and a pressure at a reference position;
- and
- a controller,
- wherein the differential pressure measuring device includes:
- a first box unit having a sealed inner space and in pressure communication with the plurality of process chambers;
- a second box unit disposed above the first box unit and having a sealed inner space;
- and
- a third box unit provided inside the second box unit and having an inner space configured to communicate with the inner space of the second box unit, and
- the pressure at the reference position is the pressure of the inner space of the third box unit,
- wherein the plurality of process chambers includes a first process chamber and a second process chamber, and
- wherein the first box unit includes a first differential pressure board which is provided in the inner space of the first box unit and is configured to measure a pressure inside the first process chamber, a second differential pressure board which is provided in the inner space of the first box unit and is configured to measure a pressure inside the second process chamber, and a reference differential pressure board which is provided in the inner space of the first box unit and is configured to measure a reference pressure.
Dependencies are inferred from the claim text.