Chamber kits, systems, and methods for calibrating temperature sensors for semiconductor manufacturing

A method of calibrating a temperature sensor applicable for semiconductor manufacturing, the method comprising:

• heating a substrate support positioned in an internal volume of a process chamber;
• irradiating, using an energy source, one or more of a first calibration substrate or a second calibration substrate positioned at least partially in an opening formed in a plate positioned in the process chamber, the plate positioned in the internal volume between the substrate support and a window that at least partially defines the internal volume;
• determining one or more actual temperatures using energy reflected off of one of the first calibration substrate or the second calibration substrate;
• determining one or more measured temperatures using energy reflected off of the other of the first calibration substrate or the second calibration substrate and received by the temperature sensor;
• and
• calibrating the temperature sensor by comparing the one or more measured temperatures and the one or more actual temperatures.

A system for processing substrates and applicable for semiconductor manufacturing, the system comprising:

• a chamber body comprising one or more sidewalls;
• a window, the one or more sidewalls and the window at least partially defining an internal volume;
• one or more heat sources configured to heat the internal volume;
• a substrate support positioned in the internal volume;
• a plate positioned in the internal volume between the substrate support and the window, the plate comprising an opening formed in an outer face of the plate;
• a temperature sensor configured to sense temperatures of the plate;
• a first calibration substrate positioned at least partially in the opening of the plate;
• a second calibration substrate positioned at least partially in the opening of the plate;
• a controller comprising instructions that, when executed, cause a plurality of operations to be conducted, the plurality of operations comprising:
• heating the substrate support,
• irradiating, using an energy source, one or more of the first calibration substrate or the second calibration substrate;
• determining one or more actual temperatures using energy reflected off of one of the first calibration substrate or the second calibration substrate;
• and
• determining one or more measured temperatures using energy reflected off of the other of the first calibration substrate or the second calibration substrate and received by the temperature sensor.