Integrated cooling module

Abstract

An integrated cooling module includes a plate-shaped manifold and multiple cooling components mounted thereon. The manifold includes stacked first and second plates that form a first refrigerant channel recessed along a line structure of the first plate, while the second plate provides a flat sealing surface. A third plate can be further stacked to form a second refrigerant channel, and through-holes in the second plate allow communication between channels. Ports formed in the plates enable direct connection with external components. A condenser, chiller, expansion valve, pressure/temperature sensor, and an accumulator may be mounted on the manifold, which is arranged perpendicular to a bottom surface.

Dependencies are inferred from the claim text.