Chemical liquid supply module and substrate treating apparatus including the same

A substrate treating apparatus comprising:

• a chamber having a treating space defined therein in which a substrate treating process is performed;
• a substrate support unit installed in the treating space and configured to rotatably support the substrate;
• a chemical liquid spray unit installed in the treating space so as to be located on top of the substrate support unit, wherein the chemical liquid spray unit is configured to spray at least one type chemical liquid onto the substrate through a spray nozzle;
• a chemical liquid supply module configured to supply the chemical liquid to the chemical liquid spray unit;
• and
• a collection unit installed in the treating space and formed in a cylindrical shape with an open top so as to surround the substrate support unit, wherein the collection unit is configured to collect the chemical liquid scattering from the substrate when the substrate rotates,
• wherein the chemical liquid supply module includes:
• a chemical liquid tank having a receiving space defined therein capable of receiving therein chemical liquid;
• a chemical liquid circulating line for supplying the chemical liquid contained in the chemical liquid tank to a chemical liquid spray unit of a substrate treating apparatus and for recirculating a remaining portion of the chemical liquid not supplied to the substrate treating apparatus to the chemical liquid tank;
• a pump unit installed at the chemical liquid circulating line and configured to control a flow rate and a pressure of the chemical liquid flowing in the chemical liquid circulating line;
• and
• a controller configured to apply a control signal to the pump unit to control a revolution per minute (RPM) of the pump unit to control a flow rate of the chemical liquid to be supplied to the substrate treating apparatus through the chemical liquid circulating line,
• wherein the pump unit includes a rotatable impeller disposed therein,
• wherein the controller is configured to vary the RPM of the impeller based on a predetermined heating temperature such that the chemical liquid to be supplied to the substrate treating apparatus through the chemical liquid circulating line is heated to the predetermined heating temperature, using friction heat generated from friction between the impeller rotating in the pump unit and the chemical liquid.

A chemical liquid supply module comprising:

• a chemical liquid tank having a receiving space defined therein capable of receiving therein chemical liquid;
• a chemical liquid circulating line for supplying the chemical liquid contained in the chemical liquid tank to a chemical liquid spray unit of a substrate treating apparatus and for recirculating a remaining portion of the chemical liquid not supplied to the substrate treating apparatus to the chemical liquid tank;
• a pump unit installed at the chemical liquid circulating line and configured to control a flow rate and a pressure of the chemical liquid flowing in the chemical liquid circulating line;
• a bypass line branching from the chemical liquid circulating line and extending to the chemical liquid tank, wherein a portion of the chemical liquid flowing through the chemical liquid circulating line flows through the bypass line to the chemical liquid tank such that a flow rate of the chemical liquid circulating through the chemical liquid circulating line is kept constant, wherein the bypass line branches from a position of the chemical liquid circulating line downstream of the pump unit in a flow direction of the chemical liquid circulating through the chemical liquid circulating line;
• and
• a controller configured to apply a control signal to the pump unit to control a revolution per minute (RPM) of the pump unit to control a flow rate of the chemical liquid to be supplied to the substrate treating apparatus through the chemical liquid circulating line,
• wherein the pump unit is embodied as a magnetic levitation-type pump configured to rotate the impeller in a non-contact manner under a magnetic force,
• wherein the pump unit includes:
• a pump housing installed at the chemical liquid circulating line, wherein the chemical liquid flows in the pump housing;
• the impeller received inside the pump housing and supported and suspended in a non-contact manner at a center of the pump housing under the magnetic force;
• and
• a motor driver including a stator installed on the pump housing and a rotor installed in the impeller and spaced apart from the stator, wherein the impeller rotates in a non-contact manner under the magnetic field generated between the stator and the rotor,
• wherein the controller is configured to vary the RPM of the impeller based on a predetermined heating temperature such that the chemical liquid to be supplied to the substrate treating apparatus through the chemical liquid circulating line is heated to the predetermined heating temperature, using friction heat generated from friction between the impeller rotating in the pump unit and the chemical liquid,
• wherein the controller is configured to:
• calculate the RPM of the impeller capable of heating the chemical liquid to the predetermined heating temperature, based on the predetermined heating temperature input thereto;
• and
• apply a control signal to the motor driver to generate the magnetic field between the stator and the rotor based on the calculated RPM.