Mounting structure for a rectifier circuit of an electrodeposition device

An electrodeposition device comprising:

• an anode and a cathode for depositing material on a deposition surface;
• a rectifier circuit comprising:
• an alternating current-to-direct current converter circuit that generates one or more direct current signals from an alternating current signal;
• and
• a plurality of direct current-to-direct current converter circuits that generate, from the one or more direct current signals, a plurality of child direct current signals to apply to a surface of the anode;
• and
• a mounting structure comprising an electrically conductive bung element physically and electrically connected to a direct current-to-direct current converter circuit of the plurality of direct current-to-direct current converter circuits of the rectifier circuit and the surface of the anode, the electrically conductive bung element disposed at least partially within a thermally conductive base element coupled to the surface of the anode.

A circuit mounting structure comprising:

• a thermally conductive base element comprising a hole through a thickness of the thermally conductive base element, the thermally conductive base element coupled to a surface of an anode of an electrodeposition device;
• an electrically conductive bung element at least partially disposed within the hole of the thermally conductive base element and electrically connected to the surface of an anode of an electrodeposition device;
• and
• a bus connector in electrical contact with the electrically conductive bung element and at least one portion of a rectifier circuit that generates one or more current signals to apply to the surface of the anode via the electrically conductive bung element.