Glass metallization process for through glass vias with high aspect ratio

A glass metallization process for through glass vias with high aspect ratio, comprising:

• a single-sided coating step:
• forming a first seed layer on a surface of a first glass substrate and forming a second seed layer on a surface of a second glass substrate;
• a bonding step:
• turning over the second glass substrate and bonding the first seed layer and the second seed layer through a bonding layer;
• a drilling step:
• forming at least one via to penetrate the second glass substrate, the second seed layer, the bonding layer, the first seed layer, and the first glass substrate;
• a pre-lubricating step:
• performing a pre-lubricating process on the first glass substrate, the first seed layer, the bonding layer, the second seed layer and the second glass substrate;
• and
• a metallization step:
• using a metal material to perform an electroplating process, so that the metal material grows from the first seed layer at a center of the at least one via toward a surface of the first glass substrate opposite to the first seed layer to fill a lower part of the at least one via and the center, and at the same time, the metal material grows from the second seed layer at the center of the at least one via toward a surface of the second glass substrate opposite to the second seed layer to fill an upper part of the at least one via and the center;
• wherein the upper part corresponds to the second glass substrate, the lower part corresponds to the first glass substrate, and the center corresponds to the second seed layer, the bonding layer and the first seed layer.