Method and plant for manufacturing a secondary packaging according to the BOD logic
AssigneeVoidless S.r.l.
InventorsMattia Bertolani, Carlo Villani, Daniel Kaidanovic, Guglielmo Franco Riva
Life of this patent
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AssigneeVoidless S.r.l.
InventorsMattia Bertolani, Carlo Villani, Daniel Kaidanovic, Guglielmo Franco Riva
Estimating the term…
The disclosure concerns a method for manufacturing a secondary packaging according to the BOD logic. The method in particular envisages managing a plurality of orders, each comprising a plurality of items. For each item, it is defined the primary cuboid circumscribed to it and for each order, it is identified the most compact arrangement of the items and the secondary cuboid circumscribed to it. The blanks representing the plane developments of the boxes that contain the secondary cuboids are then defined. After having optimized the arrangement thereof, the blanks are cut out of a sheet of packaging material. The boxes are thus assembled with the blanks and are each filled with their own order in the most compact arrangement. The disclosure further concerns a plant applying the method.
Method for manufacturing a secondary packaging according to a Box On Demand logic, comprising the steps of:
Plant for manufacturing a secondary packaging according to Box On Demand logic, comprising:
Dependencies are inferred from the claim text.