Resin sealing apparatus and sealing mold
AssigneeYamaha Robotics Co., Ltd.
InventorYudai Nomura
Life of this patent
Estimating the term…
Abstract
In a sealing mold, one of an upper mold and a lower mold is provided with one workpiece holding part that holds workpieces, and the other of the upper mold and the lower mold is provided with: clampers having structures divided from each other that individually clamp the workpieces held on the one workpiece holding part; and a cavity piece capable of moving up and down in a manner unlinked with the clamper at a central position in a plan view of each of the clampers. The sealing mold includes: a clamper spring that biases the clamper toward the workpiece holding part; and a cavity piece spring that biases the cavity piece toward the workpiece holding part.
Claims9
A sealing mold that seals a workpiece, in which an electronic component is mounted on a substrate, with a resin to process into a molded product, the sealing mold comprising:
- a first mold, comprising a workpiece holding part that holds the workpiece;
- and
- a second mold, comprising:
- a plurality of clampers having structures divided from each other that individually clamp the workpiece held on the workpiece holding part;
- a cavity piece capable of moving up and down in a manner unlinked with a respective one of the plurality of clampers at a central position in a plan view of the respective one of the plurality of clampers;
- a clamper spring that biases the respective one of the plurality of clampers toward the workpiece holding part;
- a cavity piece spring that biases the cavity piece toward the workpiece holding part;
- and
- a cavity block provided with:
- an internal space accommodating the respective one of the plurality of clampers, the cavity piece, and the clamper spring;
- and a spacing part spacing a clamper support part for each electronic component.
Dependencies are inferred from the claim text.