Back to results
US 12,660,525 B2Granted
Apparatus and methods for processing bonding semiconductor wafers
AssigneeTokyo Electron Limited
InventorsSatohiko Hoshino, Scott Lefevre, Yuji Mimura
Life of this patent
Estimating the term…
Abstract
A method for manufacturing semiconductor devices. The method includes placing a semiconductor wafer in a chamber. The method includes applying, in the chamber, a plasma that contains no fluorine. The plasma causes one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a surface of the semiconductor wafer.
Claims18
A method for manufacturing semiconductor devices, comprising:
- fluorinating one or more components of a chamber by at least one of using ion assisted deposition (IAD) or physical vapor deposition (PVD), selectively attaching the one or more components comprising fluorine to one or more positions on one or more walls of the chamber, or applying a plasma that contains no fluorine to a dummy wafer in the chamber to provide a fluorinating coating to the one or more components;
- placing a semiconductor wafer in a chamber;
- and
- applying, in the chamber, a plasma that contains no fluorine,
- wherein the plasma causes one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a surface of the semiconductor wafer.
2 more elements
A method for fabricating semiconductor devices, comprising:
- placing a first semiconductor wafer in a chamber;
- applying, in the chamber, a plasma that contains no fluorine to cause one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a first surface of the first semiconductor wafer;
- placing a second semiconductor wafer in the chamber;
- and
- applying, in the chamber, the plasma to cause the one or more components to again release its fluorine on a second surface of the second semiconductor wafer.
2 more elements
Dependencies are inferred from the claim text.