Method for producing laminate, producing apparatus for laminate, laminate, and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorHiroshi Hashigami
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorHiroshi Hashigami
Estimating the term…
A method producing a laminate with a semiconductor film that has a corundum crystal structure, includes the steps of mounting a substrate on a stage; heating the substrate, atomizing a raw material solution for film deposition, forming a gaseous mixture by mixing the atomized raw material solution for film deposition and carrier gas; and forming the film deposition by supplying the gaseous mixture to the substrate, wherein a surface roughness Ra of a contact surface with the substrate on the stage and the contact surface with the stage on the substrate is 0.5 μm or less. The method produces the laminate capable of stably forming a thick film of a corundum crystal thin film (the semiconductor film having a corundum crystal structure) with excellent crystal orientation and high quality.
A method for producing a laminate with a semiconductor film that has a corundum crystal structure, comprising the steps of:
A producing apparatus for the laminate with a semiconductor film that has a corundum crystal structure, comprising:
A laminate comprising a substrate and a semiconductor film having a corundum crystal structure directly or through other layers on a first main surface of the substrate, wherein a surface roughness Ra of a second main surface, which is the opposite side of the first main surface of the substrate, is 0.5 μm or less.
Dependencies are inferred from the claim text.