Electronic component, radiation detector, and radiation imaging system

An electronic component comprising:

• a semiconductor substrate having a first main surface and a second main surface;
• a first support member having a third main surface and a fourth main surface, at least a partial portion of the third main surface supporting at least a partial portion of the second main surface of the semiconductor substrate;
• and
• a second support member having a fifth main surface and a sixth main surface, at least a partial portion of the fifth main surface supporting at least a partial portion of the fourth main surface of the first support member,
• wherein in a case where the electronic component is seen through from a direction perpendicular to the first main surface,
• the semiconductor substrate has a first region and a second region adjoining an outer side of the first region,
• the semiconductor substrate does not overlap any of the first support member and the second support member in the first region,
• the semiconductor substrate overlaps both the first support member and the second support member in at least a partial portion of the second region,
• a first connection part configured to electrically connect the semiconductor substrate and the first support member to each other and a second connection part configured to electrically connect the first support member and the second support member to each other are provided outside the first region, and
• the first support member includes a through electrode configured to electrically connect the first connection part and the second connection part to each other.