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US 12,660,094 B2Granted
Method and apparatus for stacking printed circuit board assemblies with single reflow
AssigneeJabil Inc.
InventorsZambri Bin Samsudin, Idris Bin Mansor
Life of this patent
Estimating the term…
Abstract
Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability.
Claims15
A method for printed circuit board (PCB) assembly (PCBA) stacking with a single reflow comprising:
- placing top PCB, one or more middle PCBs, and a bottom PCB on a pick and place pallet;
- nearly simultaneously depositing solder paste on all the top PCB, the one or more middle PCBs, and the bottom PCB after placement of the top PCB, the one or more middle PCBs, and the bottom PCB on the pick and place pallet;
- picking and placing surface mount technology (SMT) components on all the top PCB, the one or more middle PCBs, and the bottom PCB to form an un-reflowed top PCB, un-reflowed one or more middle PCBs, and an un-reflowed bottom PCB after nearly simultaneously deposition of the solder paste on the top PCB, the one or more middle PCBs, and the bottom PCB;
- picking and placing the un-reflowed top PCB and the un-reflowed one or more middle PCBs on the un-reflowed bottom PCB to form a stacked assembly after placement of the SMT components on all the top PCB, the one or more middle PCBs, and the bottom PCB;
- and
- reflowing the stacked assembly in a single reflow to form a PCBA.
3 more elements
A method for printed circuit board (PCB) assembly (PCBA) stacking with a single reflow comprising:
- positioning a top PCB, one or more middle PCBs, and a motherboard PCB on a pick and place pallet;
- simultaneously transferring solder paste on all the top PCB, the one or more middle PCBs, and the motherboard PCB after positioning the top PCB, the one or more middle PCBs, and the motherboard PCB on the pick and place pallet;
- picking and placing surface mount technology (SMT) components on all the top PCB, the one or more middle PCBs, and the motherboard PCB to form an un-reflowed top PCB, un-reflowed one or more middle PCBs, and an un-reflowed motherboard PCB after simultaneously transferrin the solder paste on all the PCBs;
- stacking the un-reflowed top PCB and the un-reflowed one or more middle PCBs on the un-reflowed motherboard PCBs to form an un-reflowed stack assembly after placement of the SMT components on all the top PCB, the one or more middle PCBs, and the motherboard PCB;
- and
- reflowing the un-reflowed stacked assembly in a single reflow to form a stacked PCBA.
3 more elements
Dependencies are inferred from the claim text.