Wiring board and electronic device
AssigneeKYOCERA Corporation
InventorsKouichirou Sugai, Shinya Higuchi
Life of this patent
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Abstract
To sufficiently reduce transmission loss and noise of a signal. A signal wire is located on a first surface of an insulation substrate, a first ground and a second ground are located on the first surface of the insulation substrate with the signal wire interposed therebetween, a via conductor electrically connecting the first ground and the lower ground is located at least one of on a second surface of the insulation substrate or inside the insulation substrate, and a side-surface metal layer electrically connecting the second ground and the lower ground is located on a third surface of the insulation substrate.
Claims14
A wiring board comprising:
- an insulation substrate comprising a first surface, a second surface located opposite to the first surface, and a third surface connected to each of the first surface and the second surface;
- a signal wire located on the first surface and extending in a first direction;
- a first ground located farther away from the third surface than the signal wire is and a second ground located closer to the third surface than the signal wire is, the first ground and the second ground being located on the first surface with the signal wire interposed between the first ground and the second ground;
- a first lower ground located inside the insulation substrate;
- a second lower ground located at least one of on the second surface of the insulation substrate;
- and
- a via conductor located inside the insulation substrate and electrically connecting the first ground and the first lower ground, and
- wherein thickness of the first lower ground is greater than thickness of the first ground.
Dependencies are inferred from the claim text.