Wearable device and communication method thereof
AssigneeHTC Corporation
InventorsChun-Yih Wu, Ta-Chun Pu, Yen-Liang Kuo
Life of this patent
Estimating the term…
Abstract
A wearable device includes a carrier element, a wearable element, a SIP (System-In-Package) IC (Integrated Circuit), a first antenna element, and a second antenna element. The wearable element is connected to the carrier element. The SIP IC includes a first transceiver and a second transceiver. The SIP IC is disposed on the carrier element. The first antenna element is coupled to the first transceiver. The first antenna element is integrated with the SIP IC. The second antenna element is coupled to the second transceiver. The second antenna element is integrated with the carrier element.
Claims19
A wearable device, comprising:
- a carrier element;
- a wearable element, connected to the carrier element;
- a SIP (System-In-Package) IC (Integrated Circuit), comprising a first transceiver, a second transceiver, and a third transceiver, wherein the SIP IC is disposed on the carrier element;
- a first antenna element, coupled to the first transceiver, wherein the first antenna element is integrated with the SIP IC;
- a second antenna element, coupled to the second transceiver, wherein the second antenna element is integrated with the carrier element;
- and
- a third antenna element, coupled to the third transceiver, wherein the third antenna element is integrated with the wearable element;
- wherein the third antenna element comprises a first radiation metal piece and a second radiation metal piece, and the SIP IC is positioned between the first radiation metal piece and the second radiation metal piece;
- wherein the first antenna element comprises an antenna array disposed on a top of the SIP IC;
- and
- wherein the antenna array is in contact with the SIP IC.
A communication method, comprising the steps of:
- providing a wearable device, wherein the wearable device comprises a carrier element, a wearable element, a SIP IC, a first antenna element, a second antenna element, and a third antenna element, wherein the wearable element is connected to the carrier element, wherein the SIP IC comprises a first transceiver, a second transceiver, and a third transceiver, and wherein the SIP IC is disposed on the carrier element;
- coupling the first antenna element to the first transceiver;
- integrating the first antenna element with the SIP IC;
- coupling the second antenna element to the second transceiver;
- integrating the second antenna element with the carrier element;
- coupling the third antenna element to the third transceiver;
- and
- integrating the third antenna element with the wearable element;
- wherein the third antenna element comprises a first radiation metal piece and a second radiation metal piece, and the SIP IC is positioned between the first radiation metal piece and the second radiation metal piece;
- wherein the first antenna element comprises an antenna array disposed on a top of the SIP IC;
- and
- wherein the antenna array is in contact with the SIP IC.
Dependencies are inferred from the claim text.