Replacing traditional enclosure with encapsulated circuits for wireless power and data systems

Abstract

An encapsulated radio frequency (RF) wireless power circuit and method to produce said encapsulated RF wireless power circuits, including transmitter and receiver circuits. In an example, the circuits are used in industrial sensor applications. The encapsulation discussed herein provides benefits including that in some embodiments, it is low cost, low profile, and waterproof, amongst other benefits. The method is used to produce radio frequency (RF) wireless power transfer systems, antennas, and integrated circuits, among other devices, and is achieved via different approaches (e.g., single or multi stage over-molding or vacuum sealing), and using various types of encapsulation materials (e.g., resin or thin-film packaging) as will be discussed herein.

Dependencies are inferred from the claim text.