High speed and high density cable interconnects

A communication interconnect system comprising:

• a co-packaged cables (CPC) tile comprising:
• an array of slots formed from a first surface a first depth in the CPC tile;
• a array of a plurality of channels formed between a slot surface in each respective slot of the array of slots and a second surface opposite the first surface;
• a plurality of twinaxial cable each comprising a pair of conductors and positioned in respective slot of the array of slots such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels;
• a first plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface;
• an outer perimeter defined on the second surface and around the array of slots;
• and
• a second plurality of elastomer pins positioned along the outer perimeter at a pitch to provide liquid insulation.

A communication interconnect system comprising:

• a co-packaged cables (CPC) tile comprising:
• a slot formed from a first surface to slot surface at a first depth in the CPC tile, wherein the slot surface is formed along a ground plane layer in the CPC tile;
• a plurality of channels formed between the slot surface and a second surface opposite the first surface;
• a twinaxial cable comprising a pair of conductors and positioned in the slot such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels;
• and
• a plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface.