Terahertz carrier sending and receiving apparatus including a mode conversion structure

A terahertz carrier receiving apparatus comprising:

• a mode conversion structure comprising:
• a positioning slot comprising a boundary that is metal;
• and
• an inner cavity having a metal inner wall;
• a terahertz transmission line configured to receive a terahertz signal;
• a mode excitation structure comprising a first mode excitation structure side, a second mode excitation structure side, and a first plurality of metal through-holes distributed on both the first mode excitation structure side and the second mode excitation structure side, wherein the mode excitation structure is configured to convert the terahertz signal into an electrical signal;
• a feed transmission line configured to:
• receive an electrical signal from the mode excitation structure;
• and
• transmit the electrical signal to a radio frequency receiving circuit;
• a circuit board, wherein the feed transmission line and the mode excitation structure are fasten to the circuit board,
• wherein the mode excitation structure and one end of the terahertz transmission line are located in the inner cavity, so that the terahertz signal in the terahertz transmission line is coupled into the mode excitation structure;
• and
• a radio frequency receiving chip comprising an impedance matching structure configured to match impedance between the feed transmission line and the mode excitation structure,
• wherein the positioning slot is configured to insert a part of the circuit board and the mode excitation structure into the inner cavity, and
• wherein the boundary is pressed on the first plurality of metal through-holes.

A terahertz carrier sending apparatus comprising:

• a mode conversion structure comprising:
• a positioning slot comprising a boundary that is metal;
• and
• an inner cavity having a metal inner wall;
• a feed transmission line configured to:
• receive an electrical signal from a radio frequency sending circuit;
• and
• transmit the electrical signal;
• a mode excitation structure located in the inner cavity, wherein the mode excitation structure comprises a first mode excitation structure side and a second mode excitation structure side, and wherein the mode excitation structure is configured to:
• receive the electrical signal from the feed transmission line;
• and
• excite a terahertz signal based on the electrical signal to obtain an excited terahertz signal;
• a first plurality of metal through-holes distributed on both sides of the first mode excitation structure side and the second mode excitation structure side;
• a circuit board, wherein the feed transmission line and the mode excitation structure are fasten to the circuit board;
• and
• a radio frequency sending chip comprising an impedance matching structure configured to match impedance between the feed transmission line and the mode excitation structure,
• wherein the positioning slot is configured to insert a part of the circuit board and the mode excitation structure into the inner cavity, and
• wherein the boundary is pressed on the first plurality of metal through-holes.