Housing structure and method of manufacturing the same, and electronic device having the same

An electronic device comprising:

• a housing assembly comprising a first housing and a second housing, wherein the first housing and the second housing cooperatively form a receiving space, the second housing comprising:
• a substrate comprising a first portion, wherein the first portion comprises polybutylene terephthalate and glass fibers, the glass fibers and the polybutylene terephthalate are in a ratio between 40% and 50% by weight;
• a first adhesive layer formed on the first portion, wherein the first adhesive layer comprises polysiloxane in a range of 2% to 5% by weight, acrylic resin in a range of 3% to 5% by weight, isopropanol in a range of 20% to 30% by weight, cyclohexane in a range of 20% to 30% by weight, and toluene in a range of 20% to 30% by weight;
• a silica gel layer formed on the first adhesive layer, the first adhesive layer bonding the silica gel layer to the first portion.

A method of manufacturing a housing structure, comprising:

• providing a substrate, wherein the substrate comprises a first portion, wherein the first portion comprises polybutylene terephthalate and glass fibers, the glass fibers and the polybutylene terephthalate are in a ratio between 40% and 50% by weight;
• applying a first adhesive on the first portion, wherein the first adhesive comprises polysiloxane in a range of 2% to 5% by weight, acrylic resin in a range of 3% to 5% by weight, isopropanol in a range of 20% to 30% by weight, cyclohexane in a range of 20% to 30% by weight, and toluene in a range of 20% to 30% by weight;
• covering a silica gel raw film on the first adhesive to obtain an intermediate body;
• placing the intermediate body into a machine for hot-pressing and vulcanization molding.