Device for adjusting position of chamber and plasma process chamber including the same for semiconductor manufacturing

A semiconductor substrate processing apparatus, comprising:

• a chamber;
• a resonator housing positioned on the chamber, the resonator housing having a radio frequency (RF) coil disposed within the resonator housing;
• an RF power source connected to the chamber for applying RF power to the RF coil;
• and
• a plurality of jigs disposed about the resonator housing and attached to the chamber via pre-existing holes in the chamber, the plurality of jigs being configured for recording a position of the resonator housing.

A system for operating a semiconductor substrate processing apparatus, comprising:

• a controller including a processor and a memory;
• an actuator operationally coupled to the controller;
• a plasma processing chamber;
• a resonator housing positioned on the plasma processing chamber, the resonator housing having a radio frequency (RF) coil disposed within the resonator housing;
• an RF power source connected to the plasma processing chamber for applying RF power to the RF coil;
• and
• a plurality of jigs disposed about the resonator housing and attached to the plasma processing chamber via pre-existing holes in the plasma processing chamber, the plurality of jigs being configured for recording a position of the resonator housing, wherein the controller is programmed to
• analyze a wafer map of a surface of a semiconductor substrate in the plasma processing chamber, and
• using the wafer map, determine a position of the resonator housing from an initial position;
• and
• control the actuator to adjust one or more of the plurality of jigs to adjust the position of the resonator housing.