Signal control using temperature and resistivity changes in a conductor
AssigneeInternational Business Machines Corporation
InventorsThomas W. Liang, Matthew Doyle, Kyle Schoneck, John R. Dangler, Jason J. Bjorgaard, Kevin Daniel Escobar, Alexander Jay Wolseth, Matthew A Walther, Dylan Grace
Life of this patent
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Abstract
A signal interconnect system for dynamic overshoot and undershoot damping is provided. The signal interconnect system includes a conductor and a temperature control system. The temperature control system is configured to adjust a temperature and thereby a resistivity of the conductor for dynamically damping overshoot and the undershoot of a signal passed along the conductor.
Claims20
A signal interconnect system for dynamic overshoot and undershoot damping, comprising:
- a conductor;
- and
- a temperature control system configured to adjust a temperature and thereby a resistivity of the conductor for dynamically damping overshoot and the undershoot of a signal passed along the conductor.
A signal interconnect system for dynamic overshoot and undershoot damping, comprising:
- a conductor;
- a temperature control system configured to adjust a temperature of the conductor;
- and
- a controller coupled to the conductor and the temperature control system,
- the controller being configured to sense overshoot and undershoot in a signal passed along the conductor and to control the temperature control system to adjust a resistivity of the conductor by changing a temperature of the conductor for dynamically damping the overshoot and the undershoot of the signal.
A method of dynamic overshoot and undershoot damping for a signal interconnect system, the method comprising:
- passing a signal along a conductor;
- sensing overshoot and undershoot in the signal;
- and
- adjusting a resistivity of the conductor by changing a temperature of the conductor for dynamically damping the overshoot and the undershoot of the signal.
Dependencies are inferred from the claim text.