Resist composition and patterning process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakeshi Sasami, Masayoshi Sagehashi, Kenji Yamada
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakeshi Sasami, Masayoshi Sagehashi, Kenji Yamada
Estimating the term…
The present invention is a resist composition, including: a resin (A) having: a repeating unit represented by the general formula (p-1); a repeating unit represented by the general formula (a-1); and a repeating unit represented by the general formula (b-1); a resin (B) having: a repeating unit represented by the general formula (p-2); a repeating unit represented by the general formula (a-1); and a repeating unit represented by the general formula (b-1); and a solvent (D), wherein a content of the resin (A) contained in the resist composition is smaller than a content of the resin (B). This provides a resist composition that reduces roughness and size uniformity of a hole pattern with high resolution exceeding that of conventional resist materials even with a high exposure-dose region, that has good pattern shape after exposure, and that has excellent etching resistance.
A resist composition, comprising:
Dependencies are inferred from the claim text.