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US 12,656,671 B2Granted
Method of manufacturing EUV photo masks
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsin-Chang Lee, Pei-Cheng Hsu, Ta-Cheng Lien, Tzu Yi Wang
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Abstract
In a method of manufacturing a photo mask, an etching mask layer having circuit patterns is formed over a target layer of the photo mask to be etched. The photo mask includes a backside conductive layer. The target layer is etched by plasma etching, while preventing active species of plasma from attacking the backside conductive layer.
Claims20
A method of manufacturing a photo mask, comprising:
- placing a photo mask blank to be patterned on a stage in an etching apparatus,
- wherein the stage comprises a capture ring and a chuck including protrusions, wherein the photo mask blank is supported by the protrusions;
- placing an etching hard cover over the photo mask blank,
- wherein the etching hard cover is supported by the capture ring;
- wherein the etching hard cover has a rectangular frame shape having an opening exposing a portion of the photo mask blank to be patterned;
- and
- etching the photo mask blank through the opening in the etching hard cover.
4 more elements
A method of manufacturing a photo mask, comprising:
- placing a photo mask blank to be patterned on a stage in an etching apparatus,
- wherein the photo mask blank comprises:
- a substrate;
- a reflective multilayer disposed over the substrate;
- an absorber layer disposed over the reflective multilayer;
- and
- an etching mask layer disposed over the absorber layer, and
- wherein the stage comprises a capture ring and a chuck including protrusions configured to support the photo mask blank;
- placing an etching hard cover over and in contact with the photo mask blank,
- wherein the etching hard cover has an opening exposing a portion of the photo mask blank to be patterned;
- and
- etching the photo mask blank through the opening in the etching hard cover.
9 more elements
An etching apparatus, comprising:
- a chucking mechanism;
- a pedestal;
- a capture ring disposed on the pedestal and surrounding the chucking mechanism;
- and
- a frame-shaped etching hard cover having an opening disposed on the capture ring,
- wherein the chucking mechanism includes first protrusions configured to support a photo mask blank, and
- the etching hard cover is configured to contact an uppermost surface of the photo mask blank and expose a portion of the photo mask blank to be etched.
4 more elements
Dependencies are inferred from the claim text.