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US 12,656,655 B1Granted
Bonded electro-optic device with filled void and method of making thereof
AssigneePsiquantum, Corp.
InventorsNicholas LiCausi, James Jay McMahon
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Abstract
A method of forming an electro-optic device includes forming at least one of an electro-optic layer or a waveguide over a first substrate, forming a cladding layer over the at least one of the electro-optic layer or the waveguide, bonding a second substrate over the cladding layer, such that a void is formed at a bonding interface, removing the first substrate such that a gap is formed over the void, and filling the gap with an insulating plug.
Claims20
A method of forming an electro-optic device, comprising:
- forming at least one of an electro-optic layer or a waveguide over a first substrate;
- forming a cladding layer over the at least one of the electro-optic layer or the waveguide;
- bonding a second substrate over the cladding layer, such that a void is formed at a bonding interface;
- removing at least a portion of the first substrate such that a gap is formed, wherein the gap is continuous with the void and extends through at least a portion of the cladding layer;
- and
- filling the gap with an insulating plug.
3 more elements
An electro-optic device, comprising:
- a substrate;
- a cladding layer located over the substrate, wherein a bonding interface is present in the cladding layer;
- an insulating plug located in the cladding layer and laterally surrounded by the bonding interface;
- and
- at least one of an electro-optic layer or a waveguide embedded in the cladding layer.
2 more elements
Dependencies are inferred from the claim text.