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US 12,656,420 B2Granted
3D differential sensor
AssigneeAllegro MicroSystems, LLC
InventorsAhmad Nour Halawani, Emil Pavlov, Lorena Perdigon Toro, Sarkis Dono
Life of this patent
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Abstract
Method and apparatus for a 3D sensor having die Hall element clusters located on first and second die. In an embodiment, a sensor IC package includes a first die having first, second, and third Hall clusters having different axes of magnetic field sensitivity and a second die having a fourth Hall cluster having sensitivity in the first and third axes of sensitivity. The sensor provides 3D field sensing for stroke, end of shaft and side shaft sensing applications.
Claims27
A device, comprising:
- a first die having:
- a first Hall element cluster having magnetic field sensitivity in a first plane of sensitivity;
- a second Hall element cluster having sensitivity in a second plane of sensitivity;
- and
- a third Hall element cluster having sensitivity in the first and second planes of sensitivity and a third plane of sensitivity, wherein the first, second and third planes of sensitivity are orthogonal;
- and
- a second die having a fourth Hall element cluster having sensitivity in the third plane of sensitivity, wherein the first and second die are opposed and spaced apart by a given distance, wherein the first, second, third and fourth Hall element clusters are configured to provide differential sensing in three dimensions.
4 more elements
A method, comprising
- employing a first die having:
- a first Hall element cluster having magnetic field sensitivity in a first plane of sensitivity;
- a second Hall element cluster having sensitivity in a second plane of sensitivity;
- and
- a third Hall element cluster having sensitivity in the first and second planes of sensitivity and a third plane of sensitivity, wherein the first, second and third planes of sensitivity are orthogonal;
- and
- employing a second die having a fourth Hall element cluster having sensitivity in the third plane of sensitivity, wherein the first and second die are opposed and spaced apart by a given distance, wherein the first, second, third and fourth Hall element clusters are configured to provide differential sensing in three dimensions.
4 more elements
A device, comprising:
- a first die having:
- a first Hall element cluster having magnetic field sensitivity in a first axis of sensitivity;
- a second Hall element cluster having sensitivity in a second axis of sensitivity;
- and
- a third Hall element cluster having sensitivity in the first and second axes of sensitivity and a third axis of sensitivity, wherein the first, second and third axes of sensitivity are orthogonal;
- and
- a second die having a fourth Hall element cluster having sensitivity in the third axis of sensitivity, wherein the first and second die are opposed and spaced apart by a given distance, wherein the first, second, third and fourth Hall element clusters are configured to provide differential sensing in three dimensions.
4 more elements
Dependencies are inferred from the claim text.