Probe card for fine pitch circuit probe testing of semiconductor integrated circuit devices and methods of forming the same

A probe card for a circuit probe test system, comprising:

• a circuit board;
• an interposer structure mounted to a front side surface of the circuit board;
• a probe substrate mounted to a front side surface of the interposer structure;
• a redistribution layer comprising a plurality of conductive interconnect structures embedded in a dielectric material matrix over a front side surface of the probe substrate;
• and
• a plurality of probe pins over the front side surface of the redistribution layer, at least one probe pin of the plurality of probe pins is electrically connected to a conductive interconnect structure of the redistribution layer and an average center-to-center spacing of adjacent probe pins of the plurality of probe pins is less than 50 μm, wherein the interposer structure is elastically deformable such that the probe substrate mounted to the front side of the interposer structure is vertically displaced towards the front side surface of the circuit board in response to a force applied to the plurality of probe pins, and at least one of the plurality of probe pins has a diameter that decreases as the distance from the redistribution layer increases.

A circuit probe test system, comprising:

• a circuit board mounted to a mounting portion of the circuit probe test system and including a plurality of first electrical contacts on a surface of the circuit board;
• an interposer structure mounted to the circuit board and including a plurality of elastically deformable interposer pins;
• a probe structure mounted to the interposer structure, the probe structure comprising:
• a probe substrate comprising a plurality of second electrical contacts on a first surface of the probe substrate;
• a redistribution layer over a second surface of the probe substrate opposite the first surface;
• and
• a plurality of probe pins over the redistribution layer, wherein the elastically deformable interposer pins are configured to electrically connect the first electrical contacts on the surface of the circuit board to respective second electrical contacts on the first surface of the probe substrate, the elastically deformable interposer pins are bonded to the first electrical contacts via solder connections, and the elastically deformable interposer pins are not bonded to the second electrical contacts via solder connections, and an average center-to-center spacing between adjacent elastically deformable interposer pins is different than an average center-to-center spacing between adjacent probe pins, wherein at least one of the plurality of probe pins has a diameter that decreases as the distance from the redistribution layer increases.