Back to results
US 12,656,188 B1Granted
Micromachined thermistor
AssigneeSiTime Corporation
InventorsCarl Arft, Aaron Partridge, Paul M. Hagelin
Life of this patent
Estimating the term…
Abstract
A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.
Claims24
An integrated circuit device comprising:
- a die having a substrate, a cover, an enclosed space defined in between the substrate and the cover, the enclosed space being hermitically sealed within the die relative to an environment external to the integrated circuit device, and a micromachined thermistor within the enclosed space, the micromachined thermistor being anchored to the substrate;
- and
- wherein a body of the micromachined thermistor comprises a doped, crystalline semiconductor material.
A method of fabricating an integrated circuit device, the method comprising:
- forming a first die to have a substrate, a cover, an enclosed space defined in between the substrate and the cover, the enclosed space being hermitically sealed within the die relative to an environment external to the integrated circuit device, and a micromachined thermistor within the enclosed space, the micromachined thermistor in a manner such that it is anchored to the substrate;
- and
- wherein forming the first die comprises forming a body of the micromachined thermistor so as to include a doped, crystalline semiconductor material.
Dependencies are inferred from the claim text.