Methods for re-establishing cooling holes in components having deformation

A method for re-establishing cooling holes on a component, the method comprising:

• stripping an existing coating layer from a component;
• generating a macro file of at least one mapped location of at least one cooling hole in a zone of the component, wherein the component includes a substrate having the at least one cooling hole and determining a first parameter corresponding to the component;
• applying a new coating layer to the substrate of the component;
• collecting data at the at least one mapped location of the component having the new coating layer and determining a second parameter corresponding the component and the application of the new coating layer;
• determining a modification factor for the component based on the first parameter and the second parameter;
• modifying the at least one mapped location of the at least one cooling hole specified by the macro file based on the modification factor;
• and
• drilling the new coating layer using a laser at the at least one mapped location as modified based on the modification factor,
• wherein the first parameter corresponds to a height of the component prior to the application of the new coating layer,
• wherein the second parameter corresponds to a height of the component and the new coating layer.