Injection module for a process chamber
AssigneeApplied Materials, Inc.
InventorsChristopher S. Olsen, Kartik Bhupendra Shah, Chaitanya Anjaneyalu Prasad, Vishwas Kumar Pandey, Anilkumar Bodepudi, Erika Hansen
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AssigneeApplied Materials, Inc.
InventorsChristopher S. Olsen, Kartik Bhupendra Shah, Chaitanya Anjaneyalu Prasad, Vishwas Kumar Pandey, Anilkumar Bodepudi, Erika Hansen
Estimating the term…
The present disclosure relates to a gas injection module for a process chamber. The process chamber includes a chamber body, a rotatable substrate support disposed inside a process volume of the chamber body, the substrate support configured to have a rotational spin rate; an inlet port formed in the chamber body, and an injection module coupled to the inlet port. The injection module includes a body, one or more gas inlets coupled to the body, and a plurality of nozzles formed in a supply face of the body, the supply face configured to face inside the chamber body, and gas exiting from the injection module is configured to have a flow rate; the process chamber also includes a controller configured to operate the process chamber such that the ratio of the flow rate to the rotational spin rate is between about ⅓ and 3.
A process chamber suitable for use in semiconductor manufacturing, comprising:
A process chamber, comprising:
A process chamber, comprising:
Dependencies are inferred from the claim text.