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US 12,655,243 B2Granted
Two-part interface materials, systems including the interface material, and methods thereof
AssigneeDdp Specialty Electronic Materials US, LLC
InventorsSergio Grunder, Daniel Schneider, Andreas Lutz, Marcel Aschwanden, Nina Hillesheim
Life of this patent
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Abstract
A new composition for thermal interface materials that provide improved thermal conductivity without requiring filler materials that are expensive or abrasive.
Claims19
A two-part composition for a thermal interface material comprising:
- i) a first part comprising at least
- a) a prepolymer including two or more carbamate groups formed by blocking one or more isocyanate groups of the prepolymer;
- ii) a second part comprising at least:
- b) one or more polyamine compounds with a number average molecular weight of about and above 2000 g/mole and capable of a reaction with the prepolymer;
- wherein the composition includes:
- c) one or more catalysts for catalyzing the reaction between the prepolymer and the polyamine compounds;
- and
- d) 50 weight percent or more of one or more thermally conductive fillers, based on the total weight of the two-part composition;
- and
- wherein a molar ratio of the carbamate groups in the first part to amine groups of the polyamine compounds in the second part is from about 0.1 or more to about 10 or less.
7 more elements
Dependencies are inferred from the claim text.