Mold and method for manufacturing a component by molding and component thereof
AssigneeKurtz GmbH
InventorsJarkko Siltamaeki, Bastian Gothe, Helge Weiger, Andreas Seefried, Maximilian Drexler, Daniel S. Price, Dietmar K. Drummer, Kevin Schneider
Life of this patent
Estimating the term…
Abstract
The present invention relates to a mold for molding a component, in particular a particle foam part and a method for manufacturing the component using such a mold. In one embodiment, a mold for molding a component comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.
Claims22
A mold for molding a component, in particular a particle foam part, the mold comprising:
- a. a mixture of a polymer material and a filler material,
- b. wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field and increase the permittivity of the mold compared to the component, wherein the polymer material comprises a foamed material.
A mold for molding a component, in particular a particle foam part, the mold comprising:
- a. a mixture of a polymer material and a filler material,
- b. wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field and increase the permittivity of the mold compared to the component, wherein the filler material comprises a dielectric material, in particular a mixture of at least two inorganic materials, preferably at least one of the following:
- a metal nitride, a metal oxide, a silicon carbide and silicon nitride.
A mold for molding a component, in particular a particle foam part, the mold comprising:
- a. a mixture of a polymer material and a filler material,
- b. wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field and increase the permittivity of the mold compared to the component, wherein the electromagnetic field is in the radio frequency range of 25-30 MHz.
A mold for molding a component, in particular a particle foam part, the mold comprising:
- a. a mixture of a polymer material and a filler material,
- b. wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field and increase the permittivity of the mold compared to the component, wherein the filler material comprises a dielectric material, in particular a mixture of at least two inorganic materials, preferably at least one of the following:
- a metal carbide, a metal sulfide, a metal silicate, most preferably boron nitride, BN, or the filler material comprises at least one of the following:
- a mixture of a carbon material and an inorganic material, glassy carbon, carbon nanotubes, carbon nanobuds, aerographite, linear acetylenic carbon, q-carbon, graphene or the polymer material comprises a foamed material.
Dependencies are inferred from the claim text.