Electrode welding method and electrode welding apparatus

An electrode welding apparatus that welds a device in which a plurality of bump electrodes are disposed on a front surface of a semiconductor chip to electrodes of a wiring substrate, the electrode welding apparatus comprising:

• a laser irradiation apparatus including a laser oscillator that emits a laser beam with a wavelength having absorbability with respect to the semiconductor chip, a spatial light modulator that adjusts energy distribution of the laser beam emitted by the laser oscillator, a beam condenser that condenses a laser beam resulting from the adjustment of the energy distribution by the spatial light modulator, and a control unit that adjusts the spatial light modulator in order to make a heating temperature of the plurality of bump electrodes uniform by the laser beam with which irradiation is executed;
• a device conveying unit, including a conveying arm, configured and arranged for conveying the device to a device installing region of the semiconductor chip where the bump electrodes of the device correspond to the electrodes of the wiring substrate, wherein the conveying arm of the device conveying unit is configured and arranged to be moved with respect to the beam condenser of the laser irradiation apparatus;
• a table that supports the wiring substrate and supports the device in which the bump electrodes are positioned corresponding to the electrodes of the wiring substrate;
• and
• a processing movement mechanism that causes relative processing movement of the laser irradiation apparatus and the table, and
• wherein the conveying arm of the device conveying unit includes a suction adhesion part which further includes a frame part that surrounds a through-hole, wherein the frame part includes a plurality of suction holes therein and the through-hole is configured and arranged to allow the laser beam to pass therethrough.

An electrode welding method by which a device in which a plurality of bump electrodes are disposed on a front surface of a semiconductor chip is welded to electrodes of a wiring substrate, the electrode welding method comprising:

• a laser irradiation apparatus preparation step of preparing a laser irradiation apparatus including a laser oscillator that emits a laser beam with a wavelength having absorbability with respect to the semiconductor chip, a spatial light modulator that adjusts energy distribution of the laser beam emitted from the laser oscillator, and a control unit that adjusts the spatial light modulator in order to make a heating temperature of the plurality of bump electrodes uniform by the laser beam with which irradiation is executed;
• an electrode positioning step of positioning the bump electrodes corresponding to the electrodes of the wiring substrate, wherein the electrode positioning step includes using a device conveying unit, including a conveying arm, for conveying the device to a device installing region of the semiconductor chip where the bump electrodes of the device correspond to the electrodes of the wiring substrate;
• and
• an electrode welding step of irradiating a back surface of the semiconductor chip with the laser beam and welding the bump electrodes of the device to the electrodes of the wiring substrate, after executing the electrode positioning step, and
• wherein the conveying arm of the device conveying unit includes a suction adhesion part which further includes a frame part that surrounds a through-hole, wherein the frame part includes a plurality of suction holes therein,
• wherein, during the electrode positioning step, the conveying arm is moved with respect to the spatial light modulator of the laser irradiation apparatus,
• wherein, during the electrode welding step, the laser beam passes through the through-hole of the conveying arm, and
• wherein the electrode welding step is performed while the device is positioned within the suction adhesion part.