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US 12,653,238 B2Granted
Heating assembly, electronic vaporization apparatus, and method for preparing heating assembly
AssigneeShenzhen Smoore Technology Limited
InventorsJicai Long, Hongming Zhou
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Abstract
A heating assembly includes: a porous ceramic substrate for guiding a to-be-vaporized substrate; and a heating layer for heating and vaporizing the to-be-vaporized substrate. The heating layer includes a porous structure. The heating layer is partially filled in the porous ceramic substrate. In an embodiment, a portion of the heating layer is filled in the porous ceramic substrate along a thickness direction, and an other portion thereof is disposed outside the porous ceramic substrate.
Claims12
A heating assembly, comprising:
- a porous ceramic substrate configured to guide a to-be-vaporized substrate;
- and
- a heating layer configured to heat to vaporize the to-be-vaporized substrate,
- wherein the heating layer comprises a porous structure,
- wherein the heating layer is partially filled in the porous ceramic substrate,
- wherein a portion of the heating layer is filled in the porous ceramic substrate along a thickness direction, and another portion thereof is disposed outside the porous ceramic substrate,
- wherein a thickness of the portion of the heating layer that is disposed outside the porous ceramic substrate is 1-15 μm, and
- wherein a thickness of the portion of the heating layer that is filled into the porous ceramic substrate is 30-200 μm.
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A method for preparing a heating assembly, comprising:
- obtaining a porous ceramic substrate;
- and
- forming a heating layer having a porous structure on a surface of the porous ceramic substrate,
- wherein the heating layer is specifically sintered using a conductive slurry,
- wherein the heating layer is partially filled in the porous ceramic substrate,
- wherein the conductive slurry comprises a conductive powder and an organic carrier,
- wherein the conductive powder comprises at least one of a metal, an alloy, and a conductive ceramic,
- wherein the organic carrier comprises a main solvent, a thickener, a flow control agent, and a surfactant,
- wherein a percentage of the conductive powder to a total mass of the conductive slurry is 50%-90%, and a percentage of the organic carrier to the total mass of the conductive slurry is 10%-50%, and
- wherein a viscosity of the conductive slurry is 10000 Pa·S-1000000 Pa·S.
7 more elements
Dependencies are inferred from the claim text.