Resin composition for encapsulating light-emitting device, light source unit, and method for manufacturing light source unit

Abstract

The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied: (i) the resin composition includes a polymer (P1) including: a structural unit (A) represented by the following formula (1); and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; and (ii) the resin composition includes: a polymer (P2) including the structural unit (A); and a polymer (P3) including the structural unit (B).

Dependencies are inferred from the claim text.