A semiconductor device comprising a first conductor, a second conductor, a third conductor, a first transistor, a second transistor, and a memory element,
- wherein the second conductor is positioned above the first conductor,
- wherein the memory element is positioned above the second conductor,
- wherein the first transistor and the second transistor are positioned above the memory element,
- wherein the third conductor is positioned above the first transistor and the second transistor,
- wherein in a plan view, the third conductor is positioned in a region overlapping with the first conductor,
- wherein the first conductor is electrically connected to the second conductor,
- wherein the second conductor is electrically connected to a first terminal of the memory element and a first terminal of the first transistor,
- wherein a second terminal of the memory element is electrically connected to a first terminal of the second transistor,
- wherein a second terminal of the first transistor is electrically connected to a second terminal of the second transistor and the third conductor, and
- wherein the first transistor and the second transistor each comprise a metal oxide in a channel formation region.