Semiconductor device and electronic apparatus
AssigneeRohm Co., Ltd.
InventorsShuhei Takagiwa, Hiroshi Furutani, Takeshi Seike
Life of this patent
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AssigneeRohm Co., Ltd.
InventorsShuhei Takagiwa, Hiroshi Furutani, Takeshi Seike
Estimating the term…
For example, a semiconductor device includes one or more first subcontacts electrically conducted to a substrate. At least one of the one or more first subcontacts is formed in an element arrangement region, and has a lower impedance than the substrate. Preferably, at least one of the one or more first subcontacts is adjacent to a circuit element formed in the element arrangement region. Preferably, on the substrate, which is of a first conductivity type, an epilayer of a second conductivity type is formed, and the one or more first subcontacts include a first line having a lower impedance than the substrate, and a semiconductor region of the first conductivity type penetrating through the epilayer to electrically conduct the first line and the substrate to each other.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.