Induction-assisted gluing system and method
AssigneeGrabo LTD
InventorsNimrod Rotem, Efraim Rotem, Ariel Rotem
Life of this patent
Estimating the term…
Abstract
An inductive gluing sheet is utilized in an induction-assisted adhesive activation method in which the inductive gluing sheet includes a heat-activated adhesive substrate and a conductive substrate embedded therein. When a magnetic field is applied to the conductive substrate through a first surface or a second surface covering the inductive gluing sheet, an electric current is induced in the conductive substrate. The heat created by the electric current transfers to the heat-activated adhesive substrate via conduction and activates the heat-activated adhesive substrate. This allows for direct heating of an adhesive layer through one or more objects and even allows for reversibility of the adhesion setting process.
Claims6
A method of induction heating of an adhesive layer, comprising:
- placing a heat-activated adhesive substrate on a first surface, wherein the heat-activated adhesive substrate comprises a conductive substrate embedded therein, the conductive substrate comprising a continuously metallic structure;
- placing a second surface on the heat-activated adhesive substrate;
- energizing an induction coil to apply a time-varying magnetic field through the second surface and induce eddy currents in the conductive substrate, thereby heating the conductive substrate and activating the heat-activated adhesive substrate and causing the adhesive substrate to bond the first surface to the second surface;
- sensing an electrical impedance of the induction coil;
- and
- modulating at least one of a drive power or a frequency of the induction coil based on the sensed impedance to control heating of the conductive substrate.
Dependencies are inferred from the claim text.