Micro-speaker with integrated microphone and system

An audio system comprising:

• a first semiconductor substrate and a second semiconductor substrate;
• a micro speaker device disposed upon the first semiconductor substrate comprising:
• a first movable diaphragm layer having a first position relative to the first semiconductor substrate, wherein the first movable diaphragm is configured to be moved to a second position relative to the first semiconductor substrate to thereby create a positive or negative air pressure in response to an electrostatic charge relative to a first electrode;
• a first spring coupled to the first movable diaphragm layer and to the first semiconductor substrate, wherein the first spring is configured to provide a first restoring force to the first movable diaphragm layer when the first movable diaphragm is in the second position relative to the first semiconductor substrate;
• and
• a first encapsulation layer comprising a first cavity disposed above the first movable diaphragm and a first vent hole, wherein the first vent hole is configured to allow the positive or negative air pressure to escape the first cavity;
• one or more microphone devices disposed upon the second semiconductor substrate, wherein a first microphone device comprising:
• a second movable diaphragm layer having a third position relative to the second semiconductor substrate, wherein the second movable diaphragm is configured to be moved to a fourth position relative to the second semiconductor substrate in response to a first received sound pressure;
• a second spring coupled to the second movable diaphragm layer and to the second semiconductor substrate, wherein the second spring is configured to provide a second restoring force to the second movable diaphragm layer when the second movable diaphragm is in the third position relative to the second semiconductor substrate;
• a second electrode disposed upon the second semiconductor substrate, wherein a first microphone capacitance is formed between the second electrode and the second movable diaphragm layer;
• and
• a second encapsulation layer comprising a second cavity disposed above the second movable diaphragm and a second vent hole, wherein the second vent hole is configured to allow the first received sound pressure to enter the second cavity.