Radio-frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKiyoshi Aikawa, Takanori Uejima, Hiromichi Kitajima, Takashi Yamada, Yoshihiro Daimon
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AssigneeMurata Manufacturing Co., Ltd.
InventorsKiyoshi Aikawa, Takanori Uejima, Hiromichi Kitajima, Takashi Yamada, Yoshihiro Daimon
Estimating the term…
A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a plurality of external connection terminals disposed on the major surface; a plurality of inter-substrate connection terminals disposed between the major surfaces to couple the module substrate to the module substrate; a first electronic component (integrated circuit) including a switch; a second electronic component including a filter coupled to a power amplifier via the switch; and a third electronic component including a filter coupled to the power amplifier via the switch. The first electronic component, the second electronic component, and the third electronic component are disposed in the same module substrate.
A radio-frequency module, comprising:
Dependencies are inferred from the claim text.