Temperature control for multiple die types in a common package

A system, comprising:

• an element comprising a first die and a second die, wherein:
• the second die comprises at least a portion of a controller,
• the element comprises a co-packaged die,
• the first die comprises a memory comprising a plurality of stacked memory dies, and
• the controller comprises an integrated circuit (IC) comprising one or more dies;
• and
• a memory storing a program, which, when executed on a processor, performs an operation, the operation comprising:
• measuring a temperature of the first die;
• and
• adjusting a volume of controller traffic transmitted from the second die to the first die to change the temperature of the first die, wherein the adjusting is based on:
• (i) a target temperature for the first die;
• (ii) the measured temperature for the first die;
• and (iii) an amount of activity at the memory.

A method, comprising:

• measuring a temperature of a first die, in an element comprising the first die and a second die, wherein:
• the second die comprises at least a portion of a controller,
• the element comprises a co-packaged die,
• the first die comprises a memory comprising a plurality of stacked memory dies, and
• the controller comprises an integrated circuit (IC) comprising one or more dies;
• determining an activity level from the second die to the first die;
• and
• controlling a cooling element for the first die, based on the measured temperature of the first die and the activity level from the second die to the first die.