Film forming method and film forming device

A film forming method comprising:

• (A) preparing a substrate with a surface having a first region where a first film is exposed, and a second region where a second film formed by a material different from the first film is exposed;
• (B) forming a stepped portion in the surface such that the first region becomes higher than the second region;
• (C) supplying a liquid to the surface where the stepped portion is formed;
• and
• (D) supplying, to the surface, a processing gas that chemically changes the liquid, and moving the liquid from the second region to the first region by a reaction between the processing gas and the liquid to selectively form a film in the first region with respect to the second region,
• wherein the processing gas that chemically changes the liquid degasses an element constituting the liquid.

A film forming device comprising:

• a transferrer configured to transfer a substrate with a surface having a first region where a first film is exposed and a second region where a second film formed of a material different from the first film is exposed;
• a processing container into and from which the substrate is loaded and unloaded by the transferrer;
• a holder configured to hold the substrate horizontally within the processing container in a state where the surface of the substrate is oriented upward;
• a gas supplier configured to supply, to the surface of the substrate held by the holder, a gas that forms a stepped portion in the surface, a raw material gas supplied to the surface in which the stepped portion is formed, a reaction gas that reacts with the raw material gas, and a processing gas that chemically changes a liquid formed by the reaction between the raw material gas and the reaction gas;
• and
• a controller configured to control the transferrer and the gas supplier,
• wherein the controller is configured to execute:
• (A) loading the substrate into the processing container;
• (B) forming the stepped portion in the surface such that the first region becomes higher than the second region;
• (C) supplying the liquid formed by the reaction between the raw material gas and the reaction gas to the surface where the stepped portion is formed;
• and
• (D) supplying a processing gas to the surface, and moving the liquid from the second region to the first region by a reaction between the processing gas and the liquid to selectively form a film in the first region with respect to the second region.