Monitoring device for an injection mold
AssigneeOtto MäNner GmbH
InventorsAlexander Gehring, Siegfried Eppler, Christian Slisse
Life of this patent
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Abstract
The present disclosure is directed to a monitoring device for an injection mold. The monitoring device includes a first processing unit and a sensor interface by which during operation at least one sensor is interconnected to the first processing unit. A second processing unit is interconnected to the first processing unit via a data bus to exchange data with the first central processing unit. At least one user interface is interconnected to the second processing unit for exchanging information with a user.
Claims16
A monitoring device for attachment to a first mold half of an injection mold, the monitoring device comprising:
- a. first processing unit configured to monitor the injection mold interconnected thereto;
- b. several sensors interconnected to the first processing unit during operation, the several sensors being similar or different kinds and are interconnected in a serial and/or parallel manner, at least one sensor of the several sensors being a temperature and/or pressure sensor integrated into the injection mold;
- c. a second processing unit, interconnected to the first processing unit via a data bus and configured to exchange data with the first processing unit;
- d. at least one user interface interconnected to the second processing unit configured to exchange information with a user;
- and
- e. a first housing and a second housing, which is mechanically interconnectable to the first housing via at least one connector assembly;
- f. wherein the first housing comprises the first processing unit and the second housing comprises the second processing unit;
- and
- h. an external interface to connect the monitoring device to a control unit of a mold press.
A monitoring device for an injection mold comprising:
- a. a first processing unit configured to monitor the injection mold interconnected thereto;
- b. several sensors interconnected to the first processing unit during operation, the several sensors being similar or different kinds and are interconnected in a serial and/or parallel manner, wherein at least one sensor of the several sensors is a temperature and/or a pressure sensor integrated in the injection mold;
- c. a second processing unit, interconnected to the first processing unit via a data bus, to exchange data with the first processing unit;
- d. at least one user interface interconnected to the second processing unit for exchanging information with a user;
- e. a first housing, wherein the first processing unit and the second processing unit are arranged on a same printed circuit board or different printed circuit boards in the first housing,
- f. wherein the first processing unit is interconnected to a first power supply and the second processing unit is interconnected to a second power supply, wherein the first power supply comprises a first battery thereby guaranteeing power supply to the first processing unit for at least certain monitoring functions for several years independent from an outside power supply;
- g. wherein, for power saving reasons the first processing unit is operated at a lower clock rate than the second processing unit;
- and
- h. an external interface to interconnect the monitoring device to a control unit of a mold press.
A monitoring device for an injection mold comprising:
- a. a first processing unit configured to monitor the injection mold interconnected thereto;
- b. several sensors interconnected to the first processing unit during operation, the several sensors being similar or different kinds and are interconnected in a serial and/or parallel manner, wherein at least one sensor being a temperature and/or a pressure sensor integrated in the injection mold;
- c. a second processing unit, interconnected to the first processing unit via a data bus, to exchange data with the first processing unit;
- d. at least one user interface interconnected to the second processing unit for exchanging information with a user;
- and
- e. a first housing, wherein the first processing unit and the second processing unit are arranged on a same printed circuit board or different printed circuit boards in the first housing;
- f. wherein the first processing unit is interconnected to a first power supply and the second processing unit is interconnected to a second power supply, wherein the first power supply comprises a first battery thereby guaranteeing power supply to the first processing unit for at least certain monitoring functions for several years independent from an outside power supply;
- g. wherein, when not connected to the second power supply, the second processing unit is not activated;
- and
- h. an external interface to interconnect the monitoring device to a control unit of a mold press.
Dependencies are inferred from the claim text.