Package structure and manufacturing method thereof

A package structure, comprising:

• a connecting structure having a first surface and a second surface opposite to the first surface;
• an electronic component disposed on the first surface of the connecting structure;
• an antenna substrate structure disposed on the second surface of the connecting structure;
• a first encapsulant, disposed on the second surface of the connecting structure and laterally wrapping the antenna substrate structure;
• and a second encapsulant, disposed on the first surface of the connecting structure and wrapping around the electronic component, wherein a material of the second encapsulant is different from a material of the first encapsulant, wherein the antenna substrate structure is electrically connected with the electronic component through the connecting structure;
• wherein the second encapsulant comprises a dielectric material having a loss tangent value smaller than or substantially equal to 0.009.

A method for forming a package structure, comprising:

• providing an antenna substrate structure including at least one antenna element therein, wherein the at least one antenna element includes a first antenna and a second antenna, and the first and second antennas are of different types;
• forming a first encapsulant laterally wrapping the antenna substrate structure;
• forming a connecting structure over the first encapsulant and the antenna substrate structure;
• and
• providing an electronic component on the connecting structure and over the first encapsulant and the antenna substrate structure, wherein the connecting structure is disposed between the electronic component and the antenna substrate structure, and the antenna substrate structure is electrically connected with the electronic component through the connecting structure.