Light emitting module, method of manufacturing light emitting module, and display device

A light emitting module, comprising:

• a back frame;
• a first substrate;
• an electronic element array disposed on the first substrate, wherein the electronic element array comprises a plurality of electronic elements;
• an encapsulation layer disposed on the first substrate and covering the electronic element array;
• and
• a bonding portion disposed between the back frame and the first substrate, wherein the bonding portion comprises a first surface facing the back frame and a second surface facing the first substrate, and the first surface and the second surface are oppositely disposed,
• wherein a material of the first substrate is an organic material;
• wherein the back frame is in direct contact with the first surface of the bonding portion, and the first substrate is in direct contact with the second surface of the bonding portion;
• wherein the light emitting module comprises a plurality of film layers located between the first substrate and the electronic element array;
• wherein the plurality of film layers comprise:
• a first conductive layer located on the first substrate;
• a first planarization layer located on a side of the first conductive layer away from the first substrate;
• a second conductive layer located on a side of the first planarization layer away from the first substrate;
• and a second planarization layer located on a side of the second conductive layer away from the first substrate;
• and
• wherein the light emitting module further comprises a plurality of vent holes, the plurality of vent holes are located between the first planarization layer and the second planarization layer, and the plurality of vent holes respectively expose a part of the first planarization layer.