Imaging element and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorsMasashi Nakata, Hirotaka Shinozaki
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AssigneeSony Semiconductor Solutions Corporation
InventorsMasashi Nakata, Hirotaka Shinozaki
Estimating the term…
According to the present disclosure, there is provided an imaging element configured as a semiconductor chip, the imaging element including: an acquisition unit that acquires information regarding an optical member, the optical member being provided outside the semiconductor chip; a pixel unit including N (N is an integer) types of pixels having different spectral characteristics with respect to a wavelength of input light input via the optical member; a conversion unit that converts an output signal of the pixel unit into a digital output signal; a processing unit that performs conversion processing into N+1 or more processed signals having different spectral characteristics on the basis of an output signal output from the conversion unit by using the information; and an output unit that outputs a signal based on the processed signal to an outside of the semiconductor chip.
An imaging element configured as a semiconductor chip, the imaging element comprising:
Dependencies are inferred from the claim text.