Integrated e-machine controller for turbomachine having thermal path for compactly packaged electronics

A method of manufacturing a controller for an e-machine of a turbomachine having a rotating group that is supported for rotation about a rotation axis comprising:

• providing a fluid-cooled coolant core that extends about the rotation axis and that has a first seat and a second seat thereon, the first seat included on an outer radial area of the coolant core, the outer radial area facing outward radially from the rotation axis, the second seat included on an axial end of the coolant core and facing away from the rotating group;
• seating a semiconductor circuit component on the first seat including thermally coupling the semiconductor circuit component to the coolant core via the first seat to be cooled thereby;
• providing a bus bar that is elongated to extend along a curvilinear path;
• seating the bus bar on the second seat including extending the bus bar axis along the curvilinear path circumferentially about the rotation axis along the axial end of the coolant core and thermally coupling the bus bar to the coolant core via the second seat to be cooled thereby;
• and
• thermally coupling the bus bar to the semiconductor circuit component by a direct conductive interface therebetween to define a thermal path for heat transfer from the semiconductor circuit component, through the direct conductive interface and the bus bar, and to the coolant core.

A compressor device comprising:

• a compressor section;
• a motor configured to drive a compressor wheel of the compressor section in rotation about a rotation axis;
• and
• an integrated controller for the motor that includes:
• a fluid-cooled coolant core that extends about the rotation axis and that includes a first seat and a second seat, the first seat included on an outer radial area of the coolant core facing outward radially from the rotation axis, the second seat included on an axial end of the coolant core and facing axially away from the motor, the coolant core including an internal liquid fluid passage configured to receive a flow of a liquid coolant;
• a semiconductor circuit component that is seated on the first seat and that is thermally coupled to the coolant core via the first seat to be cooled thereby;
• a bus bar that is elongated to extend along a curvilinear path that extends circumferentially about the rotation axis along the axial end of the coolant core, that is seated on the second seat, and that is thermally coupled to the coolant core via the second seat to be cooled thereby;
• and
• the bus bar being thermally coupled to the semiconductor circuit component by a direct conductive interface therebetween to receive heat from the semiconductor circuit component and to define a thermal path from the semiconductor circuit component, through the direct conductive interface and the bus bar, and to the coolant core.