Processing method and plasma processing apparatus

A plasma processing apparatus, comprising:

• a processing chamber that is decompressible;
• a substrate support located in the processing chamber and including a support surface on which a substrate is placeable;
• and
• a controller,
• wherein the substrate support includes a channel to supply a heat transfer medium including at least one of a liquid medium or a solid medium with fluidity to between the support surface and a back surface of the substrate, and
• the controller performs control to cause operations including
• placing a temperature adjustment target onto the support surface,
• forming a heat transfer layer by supplying, through the substrate support, the heat transfer medium to between the support surface and a back surface of the temperature adjustment target,
• performing plasma processing on the substrate on the support surface on which the heat transfer layer is formed, and
• separating the temperature adjustment target from the support surface after the plasma processing.