Integrated assemblies and methods forming integrated assemblies

An integrated assembly, comprising:

• a first capacitor laterally offset from a second capacitor, the first capacitor comprising a first electrode and the second capacitor comprising a second electrode;
• a shared capacitor electrode shared by the first and second capacitors;
• a conductive bridge coupled to the first electrode of the first capacitor, the conductive bridge comprising a metal;
• and
• wherein the conductive bridge comprising at least two separate and discrete layers of material.

An integrated assembly, comprising:

• a first capacitor laterally offset from a second capacitor, the first capacitor comprising a first electrode and the second capacitor comprising a second electrode;
• a shared capacitor electrode shared by the first and second capacitors;
• and
• a conductive bridge coupled to the first electrode of the first capacitor, the conductive bridge comprising a silicide;
• and
• wherein the conductive bridge comprising at least two separate and discrete layers of material.