Ungrouping and grouping of system busses using link macros capable of joining and splitting

A multi-die system comprising:

• a die-to-die (D2D) link;
• and
• a first die coupled to the D2D link, wherein the first die comprises a first plurality of D2D nodes, wherein each of the first plurality of D2D nodes comprises a set of modular D2D transmit link macros, and wherein each of the set of modular D2D transmit link macros has a same physical shape, size, and a bandwidth capacity per transmit link macro, the multi-die system to:
• ungroup data received from a first system-on-chip (SoC) channel within the first die into a first group of data and a second group of data when a bandwidth of the first SoC channel exceeds the bandwidth capacity;
• ungroup data received from a second SoC channel within the first die into a third group of data and a fourth group of data when a bandwidth of the second SoC channel exceeds the bandwidth capacity;
• transmit, using a first D2D transmit link macro from among the set of modular D2D transmit link macros within the first die, the first group of data to a second die;
• join the second group of data with the third group of data;
• transmit, using a second D2D transmit link macro from among the set of modular D2D transmit link macros within the first die, the joined data to the second die;
• and
• transmit, using a third D2D transmit link macro from among the set of modular D2D transmit link macros within the first die, the fourth group of data to the second die.

A method for coupling a first die with a second die in a multi-die system, the method comprising:

• ungrouping data received from a first system-on-chip (SoC) channel within the first die into a first group of data and a second group of data when a bandwidth of the first SoC channel exceeds a bandwidth capacity per transmit link macro, wherein the first die comprises a first plurality of die-to-die (D2D) nodes, wherein each of the first plurality of D2D nodes comprises a set of modular D2D transmit link macros, and wherein each of the set of modular D2D link transmit macros has a same physical shape, size, and a bandwidth capacity per transmit link macro;
• ungrouping data received from a second SoC channel within the first die into a third group of data and a fourth group of data when a bandwidth of the second SoC channel exceeds the bandwidth capacity per transmit link macro;
• transmitting, using a first D2D transmit link macro from among the set of modular D2D transmit link macros, the first group of data to the second die;
• joining the second group of data with the third group of data;
• transmitting, using a second D2D transmit link macro from among the set of modular D2D transmit link macros, the joined data to the second die;
• and
• transmitting, using a third D2D transmit link macro from among the set of modular D2D transmit link macros, the fourth group of data to the second die.